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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Conquering SMT Stencil Printing Challenges & Miniature Components
This paper discusses developments in stencil laser and material technology and shows how advancements provide comparable and cost-effective alternatives to traditional electroformed stencils. The results are improved yields, cycle time reductions, and significant cost savings.
FCT Assembly
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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