| Industry Paper |
Analytical Procedures for Portable Lead-free Alloy Test Data
IPC and the Solder Products Value Council in cooperation with several leading OEMs and EMS providers has developed a set of test protocols for evaluation of new lead-free alloys on the basis of their physical properties. This paper will focus on the physical testing of lead-free alloys. The goal of this white paper is to reduce the time and effort required to characterize an alloy and thus help the electronics assembly industry improve its assembly processes without jeopardizing reliability.
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Sponsor
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Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
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