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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Analytical Procedures for Portable Lead-free Alloy Test Data
IPC and the Solder Products Value Council in cooperation with several leading OEMs and EMS providers has developed a set of test protocols for evaluation of new lead-free alloys on the basis of their physical properties. This paper will focus on the physical testing of lead-free alloys. The goal of this white paper is to reduce the time and effort required to characterize an alloy and thus help the electronics assembly industry improve its assembly processes without jeopardizing reliability.
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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