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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Guidlines for Avoiding Counterfeit Components
The surge to combat the counterfeit components in the electronic market has grown over the last 5 years and has driven many changes. The intention of this article is to minimize the acquisition of components from the Independent/Broker markets and therefore reducing your risk of obtaining counterfeit parts. Learn more ...
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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