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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Thermally Conductive Adhesives Keep Things Cool
This paper examines the challenges design engineers face as chip makers up the ante on microprocessor power and density. Through heat dissipation, thermally conductive adhesives & potting compounds play a pivotal role in the protection of today's electronics. Learn more ...
Master Bond Inc.
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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