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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

The Whisker Phenomenon

The growth of whiskers is certainly one of the most interesting phenomena in the field of metallurgy. Whiskers are monocrystals with a fine hair-like or needle-like structure. They often have a diameter of only a few microns.

Rehm Thermal Systems GmbH

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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura