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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Industry Paper

Thermal Management of Electronic Devices Article

Most electrical components are low powered devices that produce negligible amounts of thermal energy; however, there are also many devices - such as CPUs, power diodes, power transistors etc. - that produce significant amounts of heat. It is therefore extremely important that this heat is removed from the device quickly and efficiently. Read more ...
Electrolube
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura