Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Assembly of Delicate & Fragile Semiconductor Materials

Semiconductor manufacturing can require the use of many different materials including gallium (Ga) base materials. Due to the sensitive nature of some of these materials, unique assembly methods may be required to prevent chipping or fracturing from the assembly process.

Air-Vac Engineering Company, Inc.

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura