| Industry Paper |
Assembly of Delicate & Fragile Semiconductor Materials
Semiconductor manufacturing can require the use of many different materials including gallium (Ga) base materials. Due to the sensitive nature of some of these materials, unique assembly methods may be required to prevent chipping or fracturing from the assembly process.
Air-Vac Engineering Company, Inc.
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Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
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