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Ormet TLPS
Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Industry Paper

What is AOI Resolution

With so many machine vision systems on the market, and the mega pixel arms race in the consumer camera arena, the concept of resolution can be a confusing one. This document describes each of the contributing factors, and the underlying principles. This document should be essential reading for anyone interested in understanding the difference between mega pixels and resolution.
Complete the form below to download this technical paper.

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Sponsor
Advanced Interconnections Corp
Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp