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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
'01005' the AOI route to optimizing yield
With the introduction of 01005 packages in mass production, SMT lines are facing new challenges. Each process can introduce errors which are difficult to repair due to the package size. AOI is an essential tool to enable good yield with 01005 assembly.
Vi Technology
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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