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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Controlling Pressure for Coplanarity & Bonding Flip Chip
A recent conference paper shows the advantages of using Pressurex® pressure-indicating sensor film in wafer-to-wafer bonding. The film also may have similar advantages for several applications in flip chip assembly where pressure magnitude and spatial uniformity may be critical.
Sensor Products Inc.
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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