| Industry Paper |
Controlling Pressure for Coplanarity & Bonding Flip Chip
A recent conference paper shows the advantages of using Pressurex® pressure-indicating sensor film in wafer-to-wafer bonding. The film also may have similar advantages for several applications in flip chip assembly where pressure magnitude and spatial uniformity may be critical.
Sensor Products Inc.
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Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
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