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Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Industry Paper

JTAG/Boundary Scan – What Can It Do for You?

JTAG/Boundary Scan is an ingenious test technology. It is the jump from physical access to a board's conductor tracks with all its physical limitations to an electric and, therewith, unlimited access. JTAG/Boundary Scan only requires four control lines and only a fistful of important "Design for Testability" rules.
GOEPEL Electronic
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura