| Industry Paper |
Design Guidelines for Stencil Design Using Regression
Introducing fine pitch components (pitch less than 15mil) in PCA is a challenge to minimize risk of defects as solder short etc. This paper is focusing on minimizing these defects through Stencil Design.
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Sponsor
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Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
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