Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Identifying Lifted Objects using Z-axis Measurement and 3D AOI

True 3D AOI, unlike traditional 2D AOI, eliminates false alarms, escapes and inspection errors. The ability to measure the height and shape (Z-axis) of components and shiny solder joints allows a true comparison with the IPC-A-610 standard for inspection.

Koh Young Technology Inc.

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura