| Industry Paper |
Identifying Lifted Objects using Z-axis Measurement and 3D AOI
True 3D AOI, unlike traditional 2D AOI, eliminates false alarms, escapes and inspection errors. The ability to measure the height and shape (Z-axis) of components and shiny solder joints allows a true comparison with the IPC-A-610 standard for inspection.
Koh Young Technology Inc.
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Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
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