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Air-Vac Engineering
High Precision Component Milling
Automatic Removal of Electronic Components including Residual Solder on Heat Sensitive Assemblies.
Air-Vac Engineering
Industry Paper

Identifying Lifted Objects using Z-axis Measurement and 3D AOI

True 3D AOI, unlike traditional 2D AOI, eliminates false alarms, escapes and inspection errors. The ability to measure the height and shape (Z-axis) of components and shiny solder joints allows a true comparison with the IPC-A-610 standard for inspection.
Koh Young Technology Inc.
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Scoring Big With Glenbrook's Real-Time X-Ray Inspection
Jewel Box 70T helps East/West Manufacturing ensure accurate assembly of complex boards, for a system delivering statistics in seconds. Read more
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