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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
01005 production goes industry wide
01005 devices are finding their way into standard consumer products. Contract manufacturers and OEM's are demanding that Pick & Place equipment handle the components to continue to reduce end-product dimensions and costs. This paper explores how to successfully place these devices with high yields.
Assembleon America, Inc.
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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