Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

How 'Free' is Your Halogen-Free Solder Paste?

With all the talk of halogen-free in electronics, it's amazing there is no official legislation - yet. Halogen-free electronics production is here to stay and, therefore, manufacturers must be informed about the best way forward when making critical material selections.

Henkel Corporation

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura