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Ormet TLPS
Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Industry Paper

Strategies for Addressing White Residue & Contamination

A contaminated assembly has greater risk than a clean assembly. The purpose of this research is to document the root causes that promote electrochemical migration - white residue, localized contamination, end use environment, and electric potential and strategies for addressing the problem.
Kyzen Corporation
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Advanced Interconnections Corp
Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp