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Air-Vac Engineering
High Precision Component Milling
Automatic Removal of Electronic Components including Residual Solder on Heat Sensitive Assemblies.
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Industry Paper

Strategies for Addressing White Residue & Contamination

A contaminated assembly has greater risk than a clean assembly. The purpose of this research is to document the root causes that promote electrochemical migration - white residue, localized contamination, end use environment, and electric potential and strategies for addressing the problem.
Kyzen Corporation
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Glenbrook Technologies
Scoring Big With Glenbrook's Real-Time X-Ray Inspection
Jewel Box 70T helps East/West Manufacturing ensure accurate assembly of complex boards, for a system delivering statistics in seconds. Read more
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