Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Strategies for Addressing White Residue & Contamination

A contaminated assembly has greater risk than a clean assembly. The purpose of this research is to document the root causes that promote electrochemical migration - white residue, localized contamination, end use environment, and electric potential and strategies for addressing the problem.

Kyzen Corporation

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura