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Ormet TLPS
Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Industry Paper

DFx Collaboration Yields Positive Results

DFx, is the value added service of instituting best practices in the design stage to improve x, where x is desirable attributes such as manufacturability, assembly, and test. DFx can also be examined in the context of reducing total cost of ownership (TCO).
Elcoteq Americas
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Plasmatreat GmbH
Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH