| Industry Paper |
Micro-Sectioning of PCBs for Failure Analysis
Microsectioning is used to diagnose process problems in assembly. In addition this destructive technique is used to charcaterize materials used in the PCB assembly process. This paper explains some of the uses of micro-sectioning with explanatory photos.
BEST Inc.
|
Complete the form below to download this technical paper.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|
Sponsor
|
|
Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
|
|
|
