Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Jetting Systems Technology

Jetting technology has become the preferred alternative to needle dispensing in many electronic packaging and circuit board assembly applications. Jetting allows designers to rewrite their design rules to make smaller, less expensive, and more capable devices. Learn more about technology.

Nordson Electronics Solution (previously Nordson ASYMTEK)

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura