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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Thermally Conductive LED Boards
Higher wattage LED's/ power components or their placement in higher densities, requires a larger dissipation of heat in a more effective way. PCB mounting of the LED's has to date been limited to mechanical interconnection or the use of Printed Circuits Boards built on Thermally Conductive Copper Clad aluminum substrates.
Caledon Controls Limited
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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