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Ormet TLPS
Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Industry Paper

Thermally Conductive LED Boards

Higher wattage LED's/ power components or their placement in higher densities, requires a larger dissipation of heat in a more effective way.  PCB mounting of the LED's has to date been limited to mechanical interconnection or the use of Printed Circuits Boards built on Thermally Conductive Copper Clad aluminum substrates.
Caledon Controls Limited
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Sponsor
Plasmatreat GmbH
Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH