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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Care Free Storage of OSP Coated Printed Circuit Boards
IPC and SMTA continue to update Moisture Sensitive Device handling guidelines, and PCBs are their focus of attention. Lead free processing makes it an even more urgent issue. Safe storage and handling of boards requires more care and control than ever before. Download the whitepaper ...
SuperDry Totech
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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