Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Heraeus & Air-Vac Begin Joint Development of Rework Material

Advances in fine powder manufacturing technology have enabled a new generation of process-friendly solder pastes. Originally developed for BGA ball attachment and then popularized in circuit assembly for Package-on-Package (PoP) applications, dippable pastes are now being used in rework operations.

Air-Vac Engineering Company, Inc.

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura