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| Industry Paper |
Heraeus & Air-Vac Begin Joint Development of Rework Material
Advances in fine powder manufacturing technology have enabled a new generation of process-friendly solder pastes. Originally developed for BGA ball attachment and then popularized in circuit assembly for Package-on-Package (PoP) applications, dippable pastes are now being used in rework operations.
Air-Vac Engineering Company, Inc.
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