| Industry Paper |
Heraeus & Air-Vac Begin Joint Development of Rework Material
Advances in fine powder manufacturing technology have enabled a new generation of process-friendly solder pastes. Originally developed for BGA ball attachment and then popularized in circuit assembly for Package-on-Package (PoP) applications, dippable pastes are now being used in rework operations.
Air-Vac Engineering Company, Inc.
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Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
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