Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Parts Collaboration with the Sunstone ECOSystem®

This white paper explains how PCB123 CAD users can access ready-made, certified parts symbols through NXP Semiconductor and real-time parts sourcing and ordering from Digi-Key Corporation, ensuring efficient, convenient and accurate design all within the Sunstone ECOsystem®, a turn-key resource for PCB prototyping.

Sunstone Circuits

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura