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Ormet TLPS
Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Industry Paper

UltraViolet Light Cure Hybrid Epoxy Compounds

The UV cure Hybrid epoxy line of product allows fast turnaround in potting and encapsulation applications. Exposure to UV light immediately produces a cured top 'skin' sealing the liquid encapsulant. Non-exposed areas cure via the room temperature reaction route.
Star Technology, Inc.
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Sponsor
Plasmatreat GmbH
Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH