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Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Industry Paper

Combining Boundary Scan & JTAG Emulation

Boundary Scan and JTAG Emulation are two complementary methods, which are fused into a technique for advanced structural tests named VarioTAP, which provides significantly higher test quality, shorter test and programming times, and higher quality of diagnostics with considerably reduced costs.
GOEPEL Electronic
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura