| Industry Paper |
BGA Rework: Removal of Residual Solder
There are many significant advantages of utilizing an automated solder removal system over commonly used manual solder removal processes involving soldering irons and desoldering braids. This article will discuss the issues of removing higher melt point Lead-Free solder including excessive growth of intermetallic phases on pads and its impact on solder joints.
Air-Vac Engineering Company, Inc.
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Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
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