circuitnet
Sponsor
Air-Vac Engineering
High Precision Component Milling
Automatic Removal of Electronic Components including Residual Solder on Heat Sensitive Assemblies.
Air-Vac Engineering
Industry Paper

BGA Rework: Removal of Residual Solder

There are many significant advantages of utilizing an automated solder removal system over commonly used manual solder removal processes involving soldering irons and desoldering braids. This article will discuss the issues of removing higher melt point Lead-Free solder including excessive growth of intermetallic phases on pads and its impact on solder joints.
Air-Vac Engineering Company, Inc.
Complete the form below to download this technical paper.

Your Name


Your Company
Your E-mail


Your Country
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Glenbrook Technologies
Scoring Big With Glenbrook's Real-Time X-Ray Inspection
Jewel Box 70T helps East/West Manufacturing ensure accurate assembly of complex boards, for a system delivering statistics in seconds. Read more
Glenbrook Technologies