Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

BGA Rework: Removal of Residual Solder

There are many significant advantages of utilizing an automated solder removal system over commonly used manual solder removal processes involving soldering irons and desoldering braids. This article will discuss the issues of removing higher melt point Lead-Free solder including excessive growth of intermetallic phases on pads and its impact on solder joints.

Air-Vac Engineering Company, Inc.

Complete the form below to download this technical paper.

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura