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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Non-intrusive board test
Non-intrusive board test (NBT) is becoming an increasingly critical facet of contemporary board test strategies. Recent developments in basic electronic technology as well as the evolving economics of electronic test have combined to make NBT and the test technologies that comprise it a necessity.
ASSET InterTech, Inc.
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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