Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Effect of Silver in common lead-free alloys

A wide range of solder alloys containing various levels of silver has been investigated, as the industry needs to understand the effects of silver in solders from various applications perspectives. This article will present a review of the key published articles on the silver-containing alloys along with results of Cookson studies on various applications. Advantages and disadvantages of silver at different levels will be discussed.

MacDermid Alpha Electronics Solutions

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura