Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Nozzle Design in Selective Soldering Processes

Choosing the correct soldering nozzle can avoid the formation of soldering faults in the automatic selective soldering process. The design of the soldering nozzle, for example the shape or diameter, and the soldering nozzle technology used, can improve quality and reliability. This paper outlines many solutions to improve soldering.

SEHO Systems GmbH

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura