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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Error-Proof Material Management in Electronics Manufacturing
There is probably no other industry like electronics manufacturing in terms of the complexity and the critical importance of proper material management. Making a quality product at the lowest possible cost represents a formidable challenge in terms of material logistics, procurement systems, handling procedures and data acquisition technology.
Cogiscan Inc.
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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