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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Micro-Dispensing Technology
The trend toward micro-assembly continues and micro-dispensing technology is keeping pace. As electronic applications densities are increasing, component and packaging sizes are decreasing. These requirements often call for dot sizes approaching 8 mils (0.008 in.) in diameter. Learn more...
DL Technology
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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