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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Industry Paper

Key Process Issues for Lead-free Selective Soldering

Selective soldering is a flexible, adaptable process increasingly applied to an ever-widening range of soldering tasks, but it has become increasingly complicated especially since the transition to lead-free solders. This paper examines many of the process concerns, technology features, requirements, and suggestions for a manufacturer to implement successful, robust lead-free selective soldering.
Nordson SELECT
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura