Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Lead-Free Reflow Data: Convection & Condensation

The production of RoHS compliant components has resulted in one of the most expansive material changeovers in the history of electronics. In particular for the utilized components, higher soldering temperatures cause additional stressing. Moisture sensitive IC packages and electrolytic capacitors are affected to an especially great extent. Learn more...

Rehm Thermal Systems GmbH

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura