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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Design for Testability - the Importance of simple Solutions
To reduce the disadvantages of test technologies in the production test, it may be required to take advantage of component features that already exist in the circuits, thus a test concept with all hardware and software elements. Such test-oriented layout is named "Design for Testability (DFT)".
GOEPEL Electronic
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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