| Industry Paper |
Using Argon Plasma to Improved Wire Bonding Performance
Commercially-available Argon plasma cleaning systems can be used for effectively cleaning Fluorine, organic, and metal oxide contamination from the surface of a variety of microelectronic wire bonding pads in order to measurably improve the performance and reliability of wire bonding...
Nordson MARCH
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Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
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