circuitnet
Sponsor
Ormet TLPS
Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Industry Paper

Opening the door to PXI in the ECU's Design & Validation Apps

Today's Automotive and Aerospace industries are using a large number of Electronic Control Units (ECUs) in their products, and the need to validate the behaviour of these ECUs is becoming increasingly important, especially when they are used in safety critical applications. Development of a sophisticated ECU requires the unit to be rigorously tested, not only in a normal operating environment but also to discover how the unit performs when things go wrong. The purpose of Fault Insertion Simulation is to establish solid performance predictions while using several real-world conditioning parameters, ultimately ensuring the safety of driver/pilot and passengers.
Pickering Interfaces
Complete the form below to download this technical paper.

Your Name


Your Company
Your E-mail


Your Country
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Plasmatreat GmbH
Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH