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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Industry Paper

Flying Probe Tester - Prototype Design to Full Production

On top of the all important time-to-market concerns, manufacturers also have to deal with components that get ever smaller, lower in power and with limitation on test access. So how is the manufacturer expected to come up with a test strategy that will rapidly see a design progress through prototype and into full production? Mark Harding, Digitaltest Inc. sees the flying probe test platform as a potential solution.
DigitalTest, Inc.
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura