Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Identifying Flip Chip Defects

This article examines the use of 2D and 3D x-ray techniques to find and confirm manufacturing defects in flip-chip devices mounted on production circuit boards within the assembly process, thus increasing quality levels and improving yields.

Nordson Test & Inspection (previously Nordson DAGE)

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura