| Industry Paper |
Identifying Flip Chip Defects
This article examines the use of 2D and 3D x-ray techniques to find and confirm manufacturing defects in flip-chip devices mounted on production circuit boards within the assembly process, thus increasing quality levels and improving yields.
Nordson Test & Inspection
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Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
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