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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
IEEE 1149.6 Standard Boundary Scan Testing
As high-speed LVDS usage proliferates into high volume electronics products, millions of PCBAs will be manufactured daily, creating a dilemma for test engineers on how they can effectively conduct in-circuit test in the high volume environment. This paper discusses the challenges and available options for manufacturers to use IEEE 1149.6 standard boundary scan tests for their latest products.
Keysight Technologies
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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