|
| Industry Paper |
New Opportunities for 3D SPI
For some years many process engineers and quality managers have been questioning the benefits of Solder Paste Inspection (SPI). Despite the high level of defects associated with this process, the implementation of SPI inspection has not really been adopted in many SMT lines. Many users still question the cost benefit analysis.
Vi Technology
|
|
Complete the form below to download this technical paper.
|
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Insert Your Email Address |
|
