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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
High Test Coverage to ensure best Quality
Plextek traditionally designs and manufactures boards of both low-medium value/high volume (i.e. batches of 10,000 boards) and high value/low volume (e.g. batches of 10 boards). In 2000 Plextek began using the Boundary Scan system from GOEPEL to check for shorts and opens, fault isolation and repair. The methodology was extremely useful for highly complex boards, especially during the integration stage. It helps to eliminate hardware manufacturing problems as a possible cause of any software issues that were seen. Before using Boundary Scan Plextek's engineers would face uncertain and potentially lengthy integration times with unknown software and hardware.
GOEPEL Electronic
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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