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Air-Vac Engineering
High Precision Component Milling
Automatic Removal of Electronic Components including Residual Solder on Heat Sensitive Assemblies.
Air-Vac Engineering
Industry Paper

A Next Generation Process for Moisture Sensitive Devices

The influence of humidity on the reliability of electronic components is generally underestimated and often simply unknown. Moisture sensitive devices (MSDs) are electronic components encapsulated with plastic compounds and other organic materials. Moisture from atmospheric humidity enters these permeable packaging materials by diffusion and collects at the interfaces of dissimilar material ...
SuperDry Totech
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