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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
A Next Generation Process for Moisture Sensitive Devices
The influence of humidity on the reliability of electronic components is generally underestimated and often simply unknown. Moisture sensitive devices (MSDs) are electronic components encapsulated with plastic compounds and other organic materials. Moisture from atmospheric humidity enters these permeable packaging materials by diffusion and collects at the interfaces of dissimilar material ...
SuperDry Totech
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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