| Industry Paper |
MSD Handling: Desiccants and Nitrogen, Myths and Opportunities
To avoid problems with micro cracks and delaminating during the processing of electronic components, it is necessary to take appropriate storage into account. Since the introduction of lead-free soldering and the higher processing temperatures involved, the consequent vapor pressure within components increases considerably (up to 30 bars).
SuperDry Totech
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Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
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