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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
MSD Handling: Desiccants and Nitrogen, Myths and Opportunities
To avoid problems with micro cracks and delaminating during the processing of electronic components, it is necessary to take appropriate storage into account. Since the introduction of lead-free soldering and the higher processing temperatures involved, the consequent vapor pressure within components increases considerably (up to 30 bars).
SuperDry Totech
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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