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Ormet TLPS
Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Industry Paper

Environmental Challenges to PTH Metallization

The inability of PWB fabricators to meet the rapidly tightening global regulations will limit the expansion of plating facilities, the permitting of new facilities and will challenge the broader supply capacity. Despite this mounting pressure, the performance and reliability of the copper metallization system is even more critical, especially for the newer electronic devices sweeping the industry. So is there a conflict in these demands? Are there alternative green choices which will not only meet the OEM and EMS supply needs, but which will provide better performance and enable higher capability for the industry?
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Sponsor
Plasmatreat GmbH
Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH