circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Industry Paper

Environmental Challenges to PTH Metallization

The inability of PWB fabricators to meet the rapidly tightening global regulations will limit the expansion of plating facilities, the permitting of new facilities and will challenge the broader supply capacity. Despite this mounting pressure, the performance and reliability of the copper metallization system is even more critical, especially for the newer electronic devices sweeping the industry. So is there a conflict in these demands? Are there alternative green choices which will not only meet the OEM and EMS supply needs, but which will provide better performance and enable higher capability for the industry?
Complete the form below to download this technical paper.

Your Name


Your Company
Your E-mail


Your Country
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura