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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Industry Paper

Anti-Aging for Bed-Of-Nail Fixtures

In electronics manufacturing, Printed Circuit Boards (PCBs) are exposed to a process of continual change. There are several reasons for such changes. The layout of a PCB might have to be modified, in order to enhance its performance or to add new features. Also, manufacturers tend increasingly to terminate the production of certain devices - making design modifications unavoidable.
DigitalTest, Inc.
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura