Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Creep Corrosion on Lead-Free Printed Circuit Boards

The material and process changes required to eliminate lead from electronics as required by Restriction of Hazardous Substance (RoHS) legislation was likely to result in new quality and reliability issues ...

SMTA - Surface Mount Technology Association

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura