Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Beating the chip counterfeiters

As components increase in complexity their cost increases, with some specialist chips selling for many hundreds of dollars. The cost of these and many other IC's make counterfeiting them a potentially lucrative business and as always there will be people ready to make a "fast buck" at the expense of someone else.

Nordson Test & Inspection (previously Nordson DAGE)

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura