Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Qualification of A Lead-Free Card Assembly & Test Process

Since 1999, many OEM firms and their contract manufacturing partners have been converting their product portfolios to comply with EU RoHS regulations. Significant investment has been made within the electronics industry for the development of new lead-free materials and assembly processes suitable for consumer electronics applications...

SMTA - Surface Mount Technology Association

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura