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Ormet TLPS
Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Industry Paper

Qualification of A Lead-Free Card Assembly & Test Process

Since 1999, many OEM firms and their contract manufacturing partners have been converting their product portfolios to comply with EU RoHS regulations. Significant investment has been made within the electronics industry for the development of new lead-free materials and assembly processes suitable for consumer electronics applications...
SMTA
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Sponsor
Plasmatreat GmbH
Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH