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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
High-Speed Stamp Soldering
This article examines stamp soldering, a solution that provides consistent high quality by repeatedly applying accurate amounts of molten solder onto a printed circuit board using static volumetric solder stamps guaranteeing total flatness during the through-hole soldering process.
Juki Automation Systems
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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