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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Reliability of Wave FR-2

The pressure on manufacturers of electronics products to continually reduce the cost of products has continued despite the challenges of higher cost lead-free production. In many cases assemblers have been forced to attempt to build the new lead-free assemblies using the same equipment ...

MacDermid Alpha Electronics Solutions

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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura